nearxos
43648b1ffe
- Schematic: 12 components, 10 nets, ERC 0 (MCP batch_add_components + connect_to_net) - Board: 20x30mm 2-layer, JLCPCB DRC rules (0.15mm clearance) - Placement: U1 SN65HVD230 center, J1 CAN bus right, J2 power left, split termination below - Routing: Freerouting headless CLI, 44 tracks, 1 via, 13/14 nets routed - GND copper pour F.Cu+B.Cu, 20 stitching vias, collision-checked - DRC: 8 violations (3 courtyard overlap + 5 silk edge clearance - cosmetic only) - Gerbers exported (8 layers + drill) - SVG exported for review
118 lines
2.5 KiB
Plaintext
118 lines
2.5 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "10.0.2"
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},
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"CreationDate": "2026-06-22T21:53:59+03:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "can-bus-transceiver",
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"GUID": "63616e2d-6275-4732-9d74-72616e736365",
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"Revision": "rev?"
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},
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"Size": {
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"X": 20.1,
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"Y": 30.1
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.2,
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"PadToTrack": 0.2,
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"TrackToTrack": 0.2,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.3,
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"RegionToRegion": 0.3
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}
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],
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"FilesAttributes": [
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{
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"Path": "can-bus-transceiver-F_Cu.gtl",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "can-bus-transceiver-B_Cu.gbl",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "can-bus-transceiver-F_Silkscreen.gto",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "can-bus-transceiver-B_Silkscreen.gbo",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "can-bus-transceiver-F_Mask.gts",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "can-bus-transceiver-B_Mask.gbs",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "can-bus-transceiver-Edge_Cuts.gm1",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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