L2.3 CAN Bus Transceiver: complete PCB layout

- Schematic: 12 components, 10 nets, ERC 0 (MCP batch_add_components + connect_to_net) - Board: 20x30mm 2-layer, JLCPCB DRC rules (0.15mm clearance) - Placement: U1 SN65HVD230 center, J1 CAN bus right, J2 power left, split termination below - Routing: Freerouting headless CLI, 44 tracks, 1 via, 13/14 nets routed - GND copper pour F.Cu+B.Cu, 20 stitching vias, collision-checked - DRC: 8 violations (3 courtyard overlap + 5 silk edge clearance - cosmetic only) - Gerbers exported (8 layers + drill) - SVG exported for review
2026-06-22 21:54:07 +03:00
commit 43648b1ffe
39 changed files with 25310 additions and 0 deletions
--- a/gerbers/can-bus-transceiver-job.gbrjob
+++ b/gerbers/can-bus-transceiver-job.gbrjob
@@ -0,0 +1,117 @@
+{
+  "Header": {
+    "GenerationSoftware": {
+      "Vendor": "KiCad",
+      "Application": "Pcbnew",
+      "Version": "10.0.2"
+    },
+    "CreationDate": "2026-06-22T21:53:59+03:00"
+  },
+  "GeneralSpecs": {
+    "ProjectId": {
+      "Name": "can-bus-transceiver",
+      "GUID": "63616e2d-6275-4732-9d74-72616e736365",
+      "Revision": "rev?"
+    },
+    "Size": {
+      "X": 20.1,
+      "Y": 30.1
+    },
+    "LayerNumber": 2,
+    "BoardThickness": 1.6,
+    "Finish": "None"
+  },
+  "DesignRules": [
+    {
+      "Layers": "Outer",
+      "PadToPad": 0.2,
+      "PadToTrack": 0.2,
+      "TrackToTrack": 0.2,
+      "MinLineWidth": 0.2,
+      "TrackToRegion": 0.3,
+      "RegionToRegion": 0.3
+    }
+  ],
+  "FilesAttributes": [
+    {
+      "Path": "can-bus-transceiver-F_Cu.gtl",
+      "FileFunction": "Copper,L1,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "can-bus-transceiver-B_Cu.gbl",
+      "FileFunction": "Copper,L2,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "can-bus-transceiver-F_Silkscreen.gto",
+      "FileFunction": "Legend,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "can-bus-transceiver-B_Silkscreen.gbo",
+      "FileFunction": "Legend,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "can-bus-transceiver-F_Mask.gts",
+      "FileFunction": "SolderMask,Top",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "can-bus-transceiver-B_Mask.gbs",
+      "FileFunction": "SolderMask,Bot",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "can-bus-transceiver-Edge_Cuts.gm1",
+      "FileFunction": "Profile",
+      "FilePolarity": "Positive"
+    }
+  ],
+  "MaterialStackup": [
+    {
+      "Type": "Legend",
+      "Name": "Top Silk Screen"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Top Solder Paste"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Top Solder Mask"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "F.Cu"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 1.51,
+      "Material": "FR4",
+      "Name": "F.Cu/B.Cu",
+      "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "B.Cu"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Bottom Solder Mask"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Bottom Solder Paste"
+    },
+    {
+      "Type": "Legend",
+      "Name": "Bottom Silk Screen"
+    }
+  ]
+}