feat: Week 1 complete - Linux support + IPC API prep
🎉 Major v2.0 rebuild kickoff - Week 1 accomplished! ## Highlights ### Cross-Platform Support 🌍 - ✅ Linux primary platform (Ubuntu/Debian tested) - ✅ Windows fully supported - ✅ macOS experimental support - ✅ Platform-agnostic path handling (XDG spec) - ✅ Auto-detection of KiCAD installation ### Infrastructure 🏗️ - ✅ GitHub Actions CI/CD pipeline - ✅ Pytest framework with 20+ tests - ✅ Pre-commit hooks (Black, MyPy, ESLint) - ✅ Automated Linux installation script - ✅ Enhanced npm scripts ### IPC API Migration Prep 🚀 - ✅ Comprehensive migration plan (30 pages) - ✅ Backend abstraction layer (800+ lines) - ✅ Factory pattern with auto-detection - ✅ SWIG backward compatibility wrapper - ✅ IPC backend skeleton ready ### Documentation 📚 - ✅ Updated README (Linux installation) - ✅ CONTRIBUTING.md guide - ✅ Linux compatibility audit - ✅ IPC API migration plan - ✅ Session summaries - ✅ Platform-specific config templates ## Files Changed - 27 files created - ~3,000 lines of code/docs - 8 comprehensive documentation pages - 20+ unit tests - 5 abstraction layer modules ## Next Steps - Week 2: IPC API migration (project.py → component.py → routing.py) - Migrate from deprecated SWIG to official IPC API - JLCPCB/Digikey integration prep 🤖 Generated with Claude Code https://claude.com/claude-code Co-Authored-By: Claude <noreply@anthropic.com>
This commit is contained in:
KiCAD MCP Bot
321
src/prompts/design.ts
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321
src/prompts/design.ts
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/**
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* Design prompts for KiCAD MCP server
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*
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* These prompts guide the LLM in providing assistance with general PCB design tasks
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* in KiCAD.
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*/
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import { McpServer } from '@modelcontextprotocol/sdk/server/mcp.js';
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import { z } from 'zod';
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import { logger } from '../logger.js';
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/**
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* Register design prompts with the MCP server
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*
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* @param server MCP server instance
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*/
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export function registerDesignPrompts(server: McpServer): void {
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logger.info('Registering design prompts');
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// ------------------------------------------------------
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// PCB Layout Review Prompt
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// ------------------------------------------------------
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server.prompt(
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"pcb_layout_review",
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{
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pcb_design_info: z.string().describe("Information about the current PCB design, including board dimensions, layer stack-up, component placement, and routing details")
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},
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() => ({
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messages: [
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{
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role: "user",
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content: {
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type: "text",
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text: `You're helping to review a PCB layout for potential issues and improvements. Here's information about the current PCB design:
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{{pcb_design_info}}
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When reviewing the PCB layout, consider these key areas:
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1. Component Placement:
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- Logical grouping of related components
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- Orientation for efficient routing
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- Thermal considerations for heat-generating components
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- Mechanical constraints (mounting holes, connectors at edges)
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- Accessibility for testing and rework
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2. Signal Integrity:
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- Trace lengths for critical signals
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- Differential pair routing quality
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- Potential crosstalk issues
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- Return path continuity
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- Decoupling capacitor placement
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3. Power Distribution:
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- Adequate copper for power rails
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- Power plane design and continuity
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- Decoupling strategy effectiveness
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- Voltage regulator thermal management
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4. EMI/EMC Considerations:
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- Ground plane integrity
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- Potential antenna effects
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- Shielding requirements
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- Loop area minimization
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- Edge radiation control
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5. Manufacturing and Assembly:
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- DFM (Design for Manufacturing) issues
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- DFA (Design for Assembly) considerations
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- Testability features
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- Silkscreen clarity and usefulness
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- Solder mask considerations
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Based on the provided information, identify potential issues and suggest specific improvements to enhance the PCB design.`
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}
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}
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]
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})
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);
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// ------------------------------------------------------
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// Layer Stack-up Planning Prompt
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// ------------------------------------------------------
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server.prompt(
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"layer_stackup_planning",
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{
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design_requirements: z.string().describe("Information about the PCB design requirements, including signal types, speed/frequency, power requirements, and any special considerations")
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},
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() => ({
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messages: [
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{
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role: "user",
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content: {
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type: "text",
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text: `You're helping to plan an appropriate layer stack-up for a PCB design. Here's information about the design requirements:
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{{design_requirements}}
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When planning a PCB layer stack-up, consider these important factors:
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1. Signal Integrity Requirements:
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- Controlled impedance needs
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- High-speed signal routing
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- EMI/EMC considerations
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- Crosstalk mitigation
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2. Power Distribution Needs:
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- Current requirements for power rails
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- Power integrity considerations
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- Decoupling effectiveness
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- Thermal management
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3. Manufacturing Constraints:
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- Fabrication capabilities and limitations
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- Cost considerations
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- Available materials and their properties
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- Standard vs. specialized processes
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4. Layer Types and Arrangement:
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- Signal layers
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- Power and ground planes
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- Mixed signal/plane layers
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- Microstrip vs. stripline configurations
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5. Material Selection:
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- Dielectric constant (Er) requirements
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- Loss tangent considerations for high-speed
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- Thermal properties
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- Mechanical stability
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Based on the provided requirements, recommend an appropriate layer stack-up, including the number of layers, their arrangement, material specifications, and thickness parameters. Explain the rationale behind your recommendations.`
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}
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}
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]
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})
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);
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// ------------------------------------------------------
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// Design Rule Development Prompt
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// ------------------------------------------------------
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server.prompt(
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"design_rule_development",
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{
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project_requirements: z.string().describe("Information about the PCB project requirements, including technology, speed/frequency, manufacturing capabilities, and any special considerations")
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},
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() => ({
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messages: [
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{
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role: "user",
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content: {
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type: "text",
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text: `You're helping to develop appropriate design rules for a PCB project. Here's information about the project requirements:
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{{project_requirements}}
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When developing PCB design rules, consider these key areas:
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1. Clearance Rules:
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- Minimum spacing between copper features
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- Different clearance requirements for different net classes
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- High-voltage clearance requirements
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- Polygon pour clearances
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2. Width Rules:
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- Minimum trace widths for signal nets
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- Power trace width requirements based on current
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- Differential pair width and spacing
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- Net class-specific width rules
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3. Via Rules:
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- Minimum via size and drill diameter
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- Via annular ring requirements
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- Microvias and buried/blind via specifications
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- Via-in-pad rules
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4. Manufacturing Constraints:
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- Minimum hole size
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- Aspect ratio limitations
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- Soldermask and silkscreen constraints
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- Edge clearances
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5. Special Requirements:
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- Impedance control specifications
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- High-speed routing constraints
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- Thermal relief parameters
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- Teardrop specifications
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Based on the provided project requirements, recommend a comprehensive set of design rules that will ensure signal integrity, manufacturability, and reliability of the PCB. Provide specific values where appropriate and explain the rationale behind critical rules.`
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}
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}
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]
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})
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);
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// ------------------------------------------------------
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// Component Selection Guidance Prompt
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// ------------------------------------------------------
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server.prompt(
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"component_selection_guidance",
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{
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circuit_requirements: z.string().describe("Information about the circuit requirements, including functionality, performance needs, operating environment, and any special considerations")
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},
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() => ({
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messages: [
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{
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role: "user",
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content: {
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type: "text",
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text: `You're helping with component selection for a PCB design. Here's information about the circuit requirements:
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{{circuit_requirements}}
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When selecting components for a PCB design, consider these important factors:
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1. Electrical Specifications:
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- Voltage and current ratings
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- Power handling capabilities
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- Speed/frequency requirements
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- Noise and precision considerations
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- Operating temperature range
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2. Package and Footprint:
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- Space constraints on the PCB
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- Thermal dissipation requirements
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- Manual vs. automated assembly
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- Inspection and rework considerations
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- Available footprint libraries
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3. Availability and Sourcing:
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- Multiple source options
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- Lead time considerations
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- Lifecycle status (new, mature, end-of-life)
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- Cost considerations
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- Minimum order quantities
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4. Reliability and Quality:
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- Industrial vs. commercial vs. automotive grade
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- Expected lifetime of the product
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- Environmental conditions
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- Compliance with relevant standards
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5. Special Considerations:
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- EMI/EMC performance
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- Thermal characteristics
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- Moisture sensitivity
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- RoHS/REACH compliance
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- Special handling requirements
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Based on the provided circuit requirements, recommend appropriate component types, packages, and specific considerations for this design. Provide guidance on critical component selections and explain the rationale behind your recommendations.`
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}
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}
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]
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})
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);
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// ------------------------------------------------------
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// PCB Design Optimization Prompt
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// ------------------------------------------------------
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server.prompt(
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"pcb_design_optimization",
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{
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design_info: z.string().describe("Information about the current PCB design, including board dimensions, layer stack-up, component placement, and routing details"),
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optimization_goals: z.string().describe("Specific goals for optimization, such as performance improvement, cost reduction, size reduction, or manufacturability enhancement")
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},
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() => ({
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messages: [
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{
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role: "user",
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content: {
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type: "text",
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text: `You're helping to optimize a PCB design. Here's information about the current design and optimization goals:
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{{design_info}}
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{{optimization_goals}}
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When optimizing a PCB design, consider these key areas based on the stated goals:
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1. Performance Optimization:
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- Critical signal path length reduction
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- Impedance control improvement
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- Decoupling strategy enhancement
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- Thermal management improvement
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- EMI/EMC reduction techniques
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2. Manufacturability Optimization:
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- DFM rule compliance
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- Testability improvements
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- Assembly process simplification
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- Yield improvement opportunities
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- Tolerance and variation management
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3. Cost Optimization:
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- Board size reduction opportunities
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- Layer count optimization
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- Component consolidation
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- Alternative component options
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- Panelization efficiency
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4. Reliability Optimization:
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- Stress point identification and mitigation
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- Environmental robustness improvements
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- Failure mode mitigation
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- Margin analysis and improvement
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- Redundancy considerations
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5. Space/Size Optimization:
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- Component placement density
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- 3D space utilization
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- Flex and rigid-flex opportunities
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- Alternative packaging approaches
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- Connector and interface optimization
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Based on the provided information and optimization goals, suggest specific, actionable improvements to the PCB design. Prioritize your recommendations based on their potential impact and implementation feasibility.`
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}
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}
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]
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})
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);
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logger.info('Design prompts registered');
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}
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