nearxos
06db96cd57
- Restored board from commit 71dd98f (clean state before trace deletion)
- Imported best Freerouting SES: 277 tracks, 12 vias
- GND copper pours F.Cu+B.Cu, zone fill confirmed
- 60 GND stitching vias placed (collision-aware, none in U1 keepout)
- DRC: 140 violations (40 keepout + 21 via_dangling + 12 overlap + cosmetic)
- Gerbers v3 exported: gerbers-v3/ with 11 files
- JLCPCB DRC rules: 0.15mm clearance, 0.3mm min drill
- Netlist: 20 components, 17 nets, all connected
128 lines
2.7 KiB
Plaintext
128 lines
2.7 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "10.0.2"
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},
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"CreationDate": "2026-06-22T21:29:35+03:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "esp32-s3-sensor-node",
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"GUID": "65737033-322d-4733-932d-73656e736f72",
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"Revision": "rev?"
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},
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"Size": {
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"X": 65.1,
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"Y": 40.1
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.2,
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"PadToTrack": 0.2,
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"TrackToTrack": 0.2,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.3,
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"RegionToRegion": 0.3
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}
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],
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"FilesAttributes": [
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{
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"Path": "esp32-s3-sensor-node-F_Cu.gtl",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "esp32-s3-sensor-node-B_Cu.gbl",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "esp32-s3-sensor-node-F_Paste.gtp",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "esp32-s3-sensor-node-B_Paste.gbp",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "esp32-s3-sensor-node-F_Silkscreen.gto",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "esp32-s3-sensor-node-B_Silkscreen.gbo",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "esp32-s3-sensor-node-F_Mask.gts",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "esp32-s3-sensor-node-B_Mask.gbs",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "esp32-s3-sensor-node-Edge_Cuts.gm1",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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