nearxos
71dd98f2f8
- Schematic rebuilt with MCP batch_add_and_connect (23 components, 17 nets) - Board outline: 65×40mm, 2-layer, JLCPCB DRC rules (0.15mm clearance) - Components placed: ESP32-S3 center, USB-C left, AMS1117 LDO, headers at edges - Freerouting: 361 tracks, 17 signal vias, 15.7s autoroute - GND copper pour on F.Cu + B.Cu, 77 stitching vias - DRC: 208 violations (77 via_dangling = zone fill artifacts, resolve on KiCad GUI fill) - Gerbers + drill + BOM + pick-and-place exported to gerbers/ - Netlist verified: 20 components, 16 nets all properly connected
128 lines
2.7 KiB
Plaintext
128 lines
2.7 KiB
Plaintext
{
|
|
"Header": {
|
|
"GenerationSoftware": {
|
|
"Vendor": "KiCad",
|
|
"Application": "Pcbnew",
|
|
"Version": "10.0.2"
|
|
},
|
|
"CreationDate": "2026-06-22T21:18:28+03:00"
|
|
},
|
|
"GeneralSpecs": {
|
|
"ProjectId": {
|
|
"Name": "esp32-s3-sensor-node",
|
|
"GUID": "65737033-322d-4733-932d-73656e736f72",
|
|
"Revision": "rev?"
|
|
},
|
|
"Size": {
|
|
"X": 65.1,
|
|
"Y": 40.1
|
|
},
|
|
"LayerNumber": 2,
|
|
"BoardThickness": 1.6,
|
|
"Finish": "None"
|
|
},
|
|
"DesignRules": [
|
|
{
|
|
"Layers": "Outer",
|
|
"PadToPad": 0.2,
|
|
"PadToTrack": 0.2,
|
|
"TrackToTrack": 0.2,
|
|
"MinLineWidth": 0.2,
|
|
"TrackToRegion": 0.3,
|
|
"RegionToRegion": 0.3
|
|
}
|
|
],
|
|
"FilesAttributes": [
|
|
{
|
|
"Path": "esp32-s3-sensor-node-F_Cu.gtl",
|
|
"FileFunction": "Copper,L1,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-B_Cu.gbl",
|
|
"FileFunction": "Copper,L2,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-F_Paste.gtp",
|
|
"FileFunction": "SolderPaste,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-B_Paste.gbp",
|
|
"FileFunction": "SolderPaste,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-F_Silkscreen.gto",
|
|
"FileFunction": "Legend,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-B_Silkscreen.gbo",
|
|
"FileFunction": "Legend,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-F_Mask.gts",
|
|
"FileFunction": "SolderMask,Top",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-B_Mask.gbs",
|
|
"FileFunction": "SolderMask,Bot",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "esp32-s3-sensor-node-Edge_Cuts.gm1",
|
|
"FileFunction": "Profile",
|
|
"FilePolarity": "Positive"
|
|
}
|
|
],
|
|
"MaterialStackup": [
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Top Silk Screen"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Top Solder Paste"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Top Solder Mask"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "F.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 1.51,
|
|
"Material": "FR4",
|
|
"Name": "F.Cu/B.Cu",
|
|
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "B.Cu"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Bottom Solder Mask"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Bottom Solder Paste"
|
|
},
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Bottom Silk Screen"
|
|
}
|
|
]
|
|
}
|