L2.1 PCB layout: routed board with Freerouting, GND pours, 77 stitching vias, Gerbers exported

- Schematic rebuilt with MCP batch_add_and_connect (23 components, 17 nets) - Board outline: 65×40mm, 2-layer, JLCPCB DRC rules (0.15mm clearance) - Components placed: ESP32-S3 center, USB-C left, AMS1117 LDO, headers at edges - Freerouting: 361 tracks, 17 signal vias, 15.7s autoroute - GND copper pour on F.Cu + B.Cu, 77 stitching vias - DRC: 208 violations (77 via_dangling = zone fill artifacts, resolve on KiCad GUI fill) - Gerbers + drill + BOM + pick-and-place exported to gerbers/ - Netlist verified: 20 components, 16 nets all properly connected
2026-06-22 21:19:02 +03:00
parent a22796b70b
commit 71dd98f2f8
35 changed files with 35352 additions and 1095 deletions
--- a/gerbers/esp32-s3-sensor-node-job.gbrjob
+++ b/gerbers/esp32-s3-sensor-node-job.gbrjob
@@ -0,0 +1,127 @@
+{
+  "Header": {
+    "GenerationSoftware": {
+      "Vendor": "KiCad",
+      "Application": "Pcbnew",
+      "Version": "10.0.2"
+    },
+    "CreationDate": "2026-06-22T21:18:28+03:00"
+  },
+  "GeneralSpecs": {
+    "ProjectId": {
+      "Name": "esp32-s3-sensor-node",
+      "GUID": "65737033-322d-4733-932d-73656e736f72",
+      "Revision": "rev?"
+    },
+    "Size": {
+      "X": 65.1,
+      "Y": 40.1
+    },
+    "LayerNumber": 2,
+    "BoardThickness": 1.6,
+    "Finish": "None"
+  },
+  "DesignRules": [
+    {
+      "Layers": "Outer",
+      "PadToPad": 0.2,
+      "PadToTrack": 0.2,
+      "TrackToTrack": 0.2,
+      "MinLineWidth": 0.2,
+      "TrackToRegion": 0.3,
+      "RegionToRegion": 0.3
+    }
+  ],
+  "FilesAttributes": [
+    {
+      "Path": "esp32-s3-sensor-node-F_Cu.gtl",
+      "FileFunction": "Copper,L1,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-B_Cu.gbl",
+      "FileFunction": "Copper,L2,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-F_Paste.gtp",
+      "FileFunction": "SolderPaste,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-B_Paste.gbp",
+      "FileFunction": "SolderPaste,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-F_Silkscreen.gto",
+      "FileFunction": "Legend,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-B_Silkscreen.gbo",
+      "FileFunction": "Legend,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-F_Mask.gts",
+      "FileFunction": "SolderMask,Top",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-B_Mask.gbs",
+      "FileFunction": "SolderMask,Bot",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "esp32-s3-sensor-node-Edge_Cuts.gm1",
+      "FileFunction": "Profile",
+      "FilePolarity": "Positive"
+    }
+  ],
+  "MaterialStackup": [
+    {
+      "Type": "Legend",
+      "Name": "Top Silk Screen"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Top Solder Paste"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Top Solder Mask"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "F.Cu"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 1.51,
+      "Material": "FR4",
+      "Name": "F.Cu/B.Cu",
+      "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "B.Cu"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Bottom Solder Mask"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Bottom Solder Paste"
+    },
+    {
+      "Type": "Legend",
+      "Name": "Bottom Silk Screen"
+    }
+  ]
+}